NIHON-HANDA solder paste

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Nihon Handa, a Japanese leader company, can offer different types of solder paste.

From leaded alloys to lead-free ones. All pastes are available in different packagings (jar, proflow casset, syringe, etc.)

Nihon Handa is able to meet and satisfy customers and market different needs, producing powders and fluxes contained in its solder pastes.

In addition, the cooperation with Tecnolab garantees customers a constant technical support and a better order managment.

– RX 262 110 HO V1a (Sn 62% – Pb 36% – Ag 2%)

Raccomanded for applications where a low presence of flux residuals are requested and where there are fine-pitch up to 0,40mm and micro BGA on the PCB.

– PF 305 118 HO (Sn 96,5% – Ag 3% – Cu 0,5%)

Raccomanded for applications where a low presence of flux residuals are requested and where there are fine-pitch up to 0,40mm and micro BGA on the PCB.

PF 305 155 TO (Sn 96,5% – Ag 3% – Cu0,5%)

This new formula ensure a drastic VOIDs Reduction (-30%). It’s raccomanded for the application of fine-pitch up to 0,40mm and BGA or micro QFP component on the PCB.

 

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